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W25Q128BVBAP Tech Specifications

Winbond  W25Q128BVBAP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 63-VFBGA
Supplier Device Package 63-VFBGA (9x11)
Package Bulk
Base Product Number MDM-3
Mfr ITT Cannon, LLC
Product Status Active
Memory Types Non-Volatile
Series 83513-Style Micro D Metal Shell (MDM)
Operating Temperature -40°C ~ 105°C (TA)
Type D-Type, Micro-D
Number of Positions 37Positions
Color Yellow, Individual
Technology FLASH - NOR
Voltage - Supply 2.7V ~ 3.6V
Shielding Unshielded
Contact Finish Gold
Memory Size 128Mbit
Clock Frequency 104 MHz
Usage -
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O
Write Cycle Time - Word, Page 50µs, 3ms
1st Connector Receptacle, Female Sockets
2nd Connector Individual Wire Leads
Memory Organization 16M x 8
Length 2.50 (762.00mm)
Contact Finish Thickness -
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