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126007 Tech Specifications
Wakefield 126007 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Tin Plated Contacts | |
| Material | Copper | |
| Shape | Flat | |
| Contact Materials | Beryllium Copper | |
| Pitch Spacing | 2.54mm | |
| Package | Bulk | |
| Mfr | Wakefield-Vette | |
| Product Status | Active | |
| Operating Temperature | - | |
| Series | - | |
| Connector Type | DIP Socket | |
| Type | Heat Pipe | |
| Attachment Method | Epoxy or Solder | |
| Platform | - | |
| Features | - | |
| Wick Type | Sintered | |
| Working Fluid | Distilled Water | |
| Power - Cooling | - | |
| Thermal Resistance | - | |
| Minimum Bend Radius | - | |
| Width | 0.253 (6.43mm) | |
| Height | 0.098 (2.50mm) | |
| Length | 2.756 (70.00mm) | |
| Diameter | - |
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