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SI2318DS-T1-E3 Tech Specifications

Vishay  SI2318DS-T1-E3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Material Polyolefin
Number of Terminals 3Terminals
Transistor Element Material SILICON
Exterior Housing Material 1
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer VISHAY INTERTECHNOLOGY INC
Package Description TO-236, SOT-23, 3 PIN
Drain Current-Max (ID) 3 A
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Diameter before shrinkage 8.0 mm
Diameter after shrinkage 4.0 mm
Thickness after shrinkage 0.6 mm
Gross weight 12.40
Transport packaging size/quantity 105*20*16/500
JESD-609 Code e3
ECCN Code EAR99
Type Non-flame-retardant heat shrink tubing
Terminal Finish MATTE TIN
Color red
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Configuration SINGLE WITH BUILT-IN DIODE
Operating Mode ENHANCEMENT MODE
Transistor Application SWITCHING
Polarity/Channel Type N-CHANNEL
Operating temperature range -55...+125 °C
JEDEC-95 Code TO-236AB
Drain-source On Resistance-Max 0.045 Ω
DS Breakdown Voltage-Min 40 V
FET Technology METAL-OXIDE SEMICONDUCTOR
Shrink temperature +80...+120 °C
Feedback Cap-Max (Crss) 45 pF
Saturation Current 1
Operating voltage 600 V
Shrink Ratio 2 : 1
Length 1 m
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