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TE0808-05-BBE21-AZ Tech Specifications

Trenz Electronic  TE0808-05-BBE21-AZ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package Box
Mfr Trenz Electronic GmbH
Product Status Active
Operating Temperature 0°C ~ 85°C
Series -
Size / Dimension 2.050 L x 2.990 W (52.00mm x 76.00mm)
Connector Type Board-to-Board (BTB) Socket
Speed -
RAM Size 2GB
Core Processor Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Module/Board Type FPGA Core
Flash Size 128MB
Co-Processor -
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