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CUS08F30,H3F

Toshiba  CUS08F30,H3F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Package / Case SC-76, SOD-323
Mount Surface Mount
Contact Plating Silver, Tin
Mounting Type Surface Mount
Number of Pins 2Pins
Diode Element Material SILICON
Number of Elements 1 Element
Packaging Tape & Reel (TR)
Published 2014
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Capacitance 170pF
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 50μA @ 30V
Voltage - Forward (Vf) (Max) @ If 220mV @ 10mA
Forward Current 800mA
Operating Temperature - Junction 125°C Max
Output Current-Max 0.8A
Max Reverse Voltage (DC) 30V
Average Rectified Current 800mA
Peak Reverse Current 50μA
Max Repetitive Reverse Voltage (Vrrm) 30V
Capacitance @ Vr, F 170pF @ 0V 1MHz
Peak Non-Repetitive Surge Current 5A
Reverse Voltage 30V
Max Forward Surge Current (Ifsm) 5A
Max Junction Temperature (Tj) 125°C
Height 1.15mm
RoHS Status RoHS Compliant

CUS08F30,H3F

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