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TMPA8700CPN

Toshiba  TMPA8700CPN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 42Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code DIP
Package Description 0.600 INCH, 1.78 MM PITCH, PLASTIC, SDIP-42
Clock Frequency-Max 8 MHz
Number of I/O Lines 33I/O Lines
Operating Temperature-Max 70 °C
Operating Temperature-Min -30 °C
Supply Voltage-Nom 5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Max 5.5 V
Package Style IN-LINE, SHRINK PITCH
Package Shape RECTANGULAR
Package Code SDIP
Package Body Material PLASTIC/EPOXY
JESD-609 Code e0
Terminal Finish TIN LEAD
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) 240
Terminal Pitch 1.778 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 42
JESD-30 Code R-PDIP-T42
Qualification Status Not Qualified
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Seated Height-Max 4.5 mm
ROM Programmability MROM
Length 38 mm
Width 15.24 mm

TMPA8700CPN

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