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TLP759F(IGM) Tech Specifications
Toshiba TLP759F(IGM) technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Mounting Feature | THROUGH HOLE MOUNT | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Package Description | DIP-8 | |
| Current Transfer Ratio-Min | 15% | |
| Number of Elements | 1 Element | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -55 °C | |
| Power Dissipation (Max) | 0.1 W | |
| HTS Code | 8541.40.80.00 | |
| Reach Compliance Code | unknown | |
| Optoelectronic Device Type | LOGIC IC OUTPUT OPTOCOUPLER | |
| Forward Current-Max | 0.025 A | |
| Forward Voltage-Max | 1.85 V | |
| On-State Current-Max | 0.008 A | |
| Isolation Voltage-Max | 5000 V |
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