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TH50VSF0302BCXB Tech Specifications

Toshiba  TH50VSF0302BCXB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 48Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer TOSHIBA CORP
Package Description BGA, BGA48,6X8,40
Access Time-Max 100 ns
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA48,6X8,40
Package Shape RECTANGULAR
Package Style GRID ARRAY
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B48
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.04 mA
Standby Current-Max 0.00003 A
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+SRAM
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TH50VSF0302BCXB Documents

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