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BMSKTOPASA900(DCE) Tech Specifications

Toshiba  BMSKTOPASA900(DCE) technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 1206 (3216 Metric)
Supplier Device Package 1206
Product Status Active
Mfr TE Connectivity Passive Product
Package Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
Factory Pack QuantityFactory Pack Quantity 1
Manufacturer Toshiba
Brand Toshiba
RoHS Details
Series 3503
Operating Temperature -55°C ~ 155°C
Size / Dimension 0.120 L x 0.061 W (3.05mm x 1.55mm)
Tolerance ±1%
Number of Terminations 2Terminations
Temperature Coefficient ±50ppm/°C
Resistance 187 Ohms
Composition Thin Film
Power (Watts) 2W
Subcategory Development Tools
Failure Rate -
Data Bus Width 32 bit
Product Type Development Boards & Kits - ARM
Evaluation Kit Yes
Core Architecture ARM
Product Development Kits
Features -
Product Category Development Boards & Kits - ARM
Height Seated (Max) 0.023 (0.58mm)
Ratings -
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