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TPA2014D1RGP Tech Specifications

Texas Instruments  TPA2014D1RGP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Contact plating gold-plated
Number of pins 38pins
Number of Terminals 20Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code QFN
Package Description HVQCCN,
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Power-Nom 1.5 W
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x38
Gross weight 1.9 g
Operating temperature -40...163°C
ECCN Code EAR99
HTS Code 8542.33.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Current rating 3A
Pin Count 20
JESD-30 Code S-PQCC-N20
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.5 V
Number of Channels 1Channel
Seated Height-Max 1 mm
Consumer IC Type CLASS D AUDIO AMPLIFIER
Rated voltage 150V
Profile beryllium copper
Length 4 mm
Width 4 mm
Plating thickness 0.75µm
Flammability rating UL94V-0
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TPA2014D1RGP Documents

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