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TL331KDBVT Tech Specifications
Texas Instruments TL331KDBVT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 4 days ago) | |
| Factory Lead Time | 6 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-74A, SOT-753 | |
| Number of Pins | 5Pins | |
| Weight | 15.790684mg | |
| Number of Elements | 1 Element | |
| Operating Temperature | -40°C~105°C | |
| Packaging | Tape & Reel (TR) | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 5Terminations | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Type | Differential | |
| Packing Method | TUBE | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 5V | |
| Base Part Number | TL331 | |
| Pin Count | 5 | |
| Output Type | CMOS, MOS, Open-Collector, TTL | |
| Power Supplies | 5V | |
| Nominal Supply Current | 700μA | |
| Output Current | 20mA | |
| Max Supply Current | 700μA | |
| Quiescent Current | 700μA | |
| Response Time | 1.3 μs | |
| Voltage - Supply, Single/Dual (±) | 2V~36V ±1V~18V | |
| Input Offset Voltage (Vos) | 5mV | |
| Voltage Gain | 106.02dB | |
| Supply Voltage Limit-Max | 36V | |
| Max Input Current | 250nA | |
| Input Bias Current | 250nA | |
| Voltage - Input Offset (Max) | 5mV @ 30V | |
| Current - Input Bias (Max) | 0.25μA @ 5V | |
| Height | 1.45mm | |
| Length | 2.9mm | |
| Width | 1.6mm | |
| Thickness | 1.2mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
TL331KDBVT Documents
Download datasheets and manufacturer documentation for TL331KDBVT
- PCN Design/SpecificationSOT23, VSSOP Cu Wire 28/Jun/2013 Copper Wire Revision C 24/Sep/2014
- PCN Assembly/OriginMult Devices 27/Jun/2017
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