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TDA2EGBDQCBDQ1 Tech Specifications
Texas Instruments TDA2EGBDQCBDQ1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 538Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | LFBGA, | |
| Date Of Intro | 2018-08-26 | |
| Moisture Sensitivity Levels | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Supply Voltage-Max | 1.2 V | |
| Supply Voltage-Min | 1.11 V | |
| Supply Voltage-Nom | 1.15 V | |
| JESD-609 Code | e1 | |
| ECCN Code | 5A992.C | |
| Terminal Finish | TIN SILVER COPPER | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 0.65 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| JESD-30 Code | S-PBGA-B538 | |
| Temperature Grade | AUTOMOTIVE | |
| uPs/uCs/Peripheral ICs Type | SoC | |
| Seated Height-Max | 1.298 mm | |
| Screening Level | AEC-Q100 | |
| Length | 17 mm | |
| Width | 17 mm |
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