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- SN74LVC1G126DCKT
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SN74LVC1G126DCKT Tech Specifications
Texas Instruments SN74LVC1G126DCKT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 5 days ago) | |
| Factory Lead Time | 6 Weeks | |
| Contact Plating | Gold | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 5-TSSOP, SC-70-5, SOT-353 | |
| Number of Pins | 5Pins | |
| Operating Temperature | -40°C~125°C TA | |
| Packaging | Tape & Reel (TR) | |
| Series | 74LVC | |
| JESD-609 Code | e4 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 5Terminations | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Packing Method | TR | |
| Voltage - Supply | 1.65V~5.5V | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.3V | |
| Base Part Number | 74LVC1G126 | |
| Pin Count | 5 | |
| Output Type | 3-State | |
| Polarity | Non-Inverting | |
| Power Supplies | 3.3V | |
| Number of Channels | 1Channel | |
| Number of Ports | 2Ports | |
| Number of Bits | 1Bit | |
| Propagation Delay | 9.8 ns | |
| Quiescent Current | 10μA | |
| Turn On Delay Time | 9.8 ns | |
| Family | LVC/LCX/Z | |
| Logic Function | Buffer, Inverting | |
| Logic Type | Buffer, Non-Inverting | |
| Max I(ol) | 0.032 A | |
| Control Type | ENABLE HIGH | |
| Number of Output Lines | 1Output Line | |
| Count Direction | UNIDIRECTIONAL | |
| Height | 1.1mm | |
| Length | 2mm | |
| Width | 1.25mm | |
| Thickness | 900μm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
SN74LVC1G126DCKT Documents
Download datasheets and manufacturer documentation for SN74LVC1G126DCKT
- PCN Design/SpecificationDBV & DCK Pkg LVC LL Select Dev Die Conversion 16/Dec/2015 Copper Wire Revision A 03/Nov/2014
- PCN Assembly/OriginMult Devices 02/Oct/2017
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