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OMAP5910JZZG2 Tech Specifications

Texas Instruments  OMAP5910JZZG2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 289-TFBGA
Mount Surface Mount
Number of Pins 289Pins
Weight 274.791928mg
Memory Types FLASH
Series OMAP-59xx
Packaging Tray
Operating Temperature -40°C~85°C TC
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 289Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.6V
Terminal Pitch 0.5mm
Frequency 150MHz
Base Part Number OMAP5910
Pin Count 289
Operating Supply Voltage 1.6V
Voltage 1.675V
Interface I2C, MMC, SDIO, UART, USB
Memory Size 32kB
Nominal Supply Current 170mA
RAM Size 160kB
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, MIXED
Core Processor ARM9TDMI
Bit Size 16
Data Bus Width 32b
Number of Timers/Counters 6Timers/Counters
Address Bus Width 25
Core Architecture ARM
On Chip Program ROM Width 16
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.75V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers SDRAM
USB USB 2.0 (2)
Additional Interfaces 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART
Co-Processors/DSP Signal Processing; C55x, System Control; CP15
ROM Programmability MROM
Barrel Shifter NO
Internal Bus Architecture MULTIPLE
Display & Interface Controllers Keypad, LCD
Number of DMA Channels 6DMA Channels
Length 12mm
Height Seated (Max) 1.2mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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