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AM3352BZCZ30 Tech Specifications

Texas Instruments  AM3352BZCZ30 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Factory Lead Time 6 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 324-LFBGA
Number of Pins 324Pins
Supplier Device Package 324-NFBGA(15x15)
Memory Types ROM
Operating Temperature 0°C~90°C TJ
Packaging Tray
Series Sitara™
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 125°C
Min Operating Temperature -40°C
Frequency 300MHz
Base Part Number AM3352
Operating Supply Voltage 1.1V
Voltage 1.144V
Interface CAN, Ethernet, I2C, SPI, UART, USB
Memory Size 64kB
Speed 300MHz
RAM Size 64kB
Core Processor ARM® Cortex®-A8
Data Bus Width 32b
Number of Timers/Counters 10Timers/Counters
Core Architecture ARM
Max Frequency 300MHz
Voltage - I/O 1.8V 3.3V
Number of UART Channels 6UART Channels
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR, DDR2, DDR3, DDR3L
USB USB 2.0 + PHY (2)
Additional Interfaces CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Number of Cores 1Core
Security Features Cryptography, Random Number Generator
Display & Interface Controllers LCD, Touchscreen
Height 1.4mm
Length 15mm
Width 15mm
Thickness 900μm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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