Teledyne LeCroy PACC-CD007
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PACC-CD007 Tech Specifications
Teledyne LeCroy PACC-CD007 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Mount | Solder | |
| Series | HFP | |
| Published | 2005 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Tip - Type | Solder-In Ground | |
| Quantity | 2 Pieces | |
| RoHS Status | Non-RoHS Compliant |
PACC-CD007 Documents
Download datasheets and manufacturer documentation for PACC-CD007
- DatasheetsHFP Series Accessory Guide
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