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TC900AIJA Tech Specifications

TelCom Semiconductor  TC900AIJA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 8Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TELCOM SEMICONDUCTOR INC
Package Description DIP, DIP8,.3
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.33.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-XDIP-T8
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.2 mA
Architecture CHOPPER-STAB
Amplifier Type OPERATIONAL AMPLIFIER
Neg Supply Voltage-Nom (Vsup) -5 V
Low-Offset YES
Frequency Compensation YES
Supply Voltage Limit-Max 9 V
Low-Bias YES
Micropower YES
Bias Current-Max (IIB) @25C 0.00005 µA
Programmable Power NO
Input Offset Voltage-Max 5 µV
Wideband NO
Power NO
Voltage Gain-Min 1000000
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TC900AIJA Documents

Download datasheets and manufacturer documentation for   TC900AIJA

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