Telcom Semiconductor Inc TC430CPA Specialized Interfaces DUAL
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Mult. : 1
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TC430CPA Tech Specifications
TelCom Semiconductor TC430CPA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 8Terminals | |
| Package Description | DIP, DIP8,.3 | |
| Ihs Manufacturer | TELCOM SEMICONDUCTOR INC | |
| Part Life Cycle Code | Obsolete | |
| Rohs Code | No | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| JESD-609 Code | e0 | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL |
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