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BACC65BUMN Tech Specifications

TE Connectivity  BACC65BUMN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Package / Case 14-DIP (0.300, 7.62mm)
Contact Plating 50 microinches Gold Plate
Shell Material Composite
Supplier Device Package 14-PDIP
Voltage - Supply Span (Max) 15.5 V
Package Bulk
Mfr National Semiconductor
Product Status Active
Voltage - Supply Span (Min) 4.5 V
Contact Materials Copper Alloy
Unit Weight 0.824529 oz
Factory Pack QuantityFactory Pack Quantity 1
Manufacturer TE Connectivity
Brand TE Connectivity / DEUTSCH
RoHS Details
Manufacturer Part Number BACC65BUMN
Part Life Cycle Code Active
Ihs Manufacturer TE CONNECTIVITY LTD
Risk Rank 1.58
Operating Temperature -40°C ~ 85°C
Series LMC®
Connector Type Rectangular
Subcategory MIL-Spec / MIL-Type
Shielding Yes
Reach Compliance Code unknown
Output Type Push-Pull, Rail-to-Rail
Number of Circuits 4Circuits
Connector Style Plug
Current - Supply 2.2mA (x4 Channels)
Slew Rate 1.5V/µs
Amplifier Type CMOS
Current - Input Bias 0.01 pA
Gain Bandwidth Product 1.3 MHz
Product Type Rectangular MIL Spec Connectors
Voltage - Input Offset 150 µV
Current - Output / Channel 34 mA
Shell Plating Nickel
Product Category Rectangular MIL Spec Connectors
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