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- 4000-01C02BB458
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4000-01C02BB458 Tech Specifications
TE Connectivity 4000-01C02BB458 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Through Hole | |
| Material - Insulation | Polyamide (PA46), Nylon 4/6 | |
| Lead Free Status / RoHS Status | -- | |
| Contact Materials | Phosphor Bronze | |
| Package | Bulk | |
| Mfr | TE Connectivity Potter & Brumfield Relays | |
| Product Status | Obsolete | |
| Operating Temperature | -- | |
| Series | -- | |
| Packaging | Bulk | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | -- | |
| Termination | Solder, Staggered | |
| Number of Positions | 184Positions | |
| Color | White | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Contact Type | -- | |
| Pitch | 0.050 (1.27mm) | |
| Contact Finish | Gold | |
| Card Type | PCI 5V 64 Bit | |
| Read Out | Dual | |
| Number of Positions/Bay/Row | -- | |
| Flange Feature | -- | |
| Features | Board Guide | |
| Contact Finish Thickness | Flash | |
| Card Thickness | 0.062 (1.57mm) |
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