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2-2013310-3 Tech Specifications

TE Connectivity  2-2013310-3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Contact Plating Gold Over Nickel
Mount Surface Mount
Housing Material Thermoplastic
Manufacturer Part Number 2-2013310-3
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer TE CONNECTIVITY LTD
Risk Rank 7.98
Samacsys Description DIMM Connectors EMBOS TAPE DDR3 204P 9.2H STD AU 0.76
Contact Finish Mating NOT SPECIFIED
Contact Materials NOT SPECIFIED
Body Orientation Right Angle
Voltage, Rating 1.5V
Number of Contact Rows 2Contact Rows
Row Spacing (mm) 8.2(mm)
Product Depth (mm) 26.5(mm)
Termination Method Solder
Mounting Styles Surface Mount
Grid Size Not Required
Rad Hardened No
Pitch (mm) 0.6(mm)
Insulation Materials Thermoplastic
RoHS Compliant
Memory Types DDR, SDRAM
Packaging Tape and Reel
Termination SMD/SMT
ECCN Code EAR99
Type SO DIMM Socket
Number of Positions 204Positions
Number of Rows 1Row
Gender SKT
HTS Code 8536.69.40.40
Pitch 600 µm
Orientation Right Angle
Reach Compliance Code compliant
Current Rating 0.5/Contact(A)
Number of Contacts 204(POS)Contact
Housing Color Black
Row Spacing 8.2 mm
ELV Compliant
Product Length (mm) 72.7(mm)
Height 9.2 mm
Stack Height 9.2 mm
Product Height (mm) 9.9(mm)
Radiation Hardening No
Flammability Rating UL94 V-0
Lead Free Lead Free
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