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HF30ACC201209-T Tech Specifications

TDK  HF30ACC201209-T technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago)
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0805 (2012 Metric)
Material Ferrite
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Series HF-ACC
Published 2001
Size / Dimension 0.079Lx0.049W 2.00mmx1.25mm
Tolerance 25%
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
ECCN Code EAR99
HTS Code 8504.50.80.00
Packing Method TAPE AND REEL
Shielding Unshielded
Number of Functions 1Function
Depth 1.45mm
Construction Chip Bead
Case Code (Metric) 2012
Case Code (Imperial) 0805
Test Frequency 100MHz
Impedance 7Ohm
Max DC Current 1.5A
Filter Type Signal Line
Number of Lines 1Line
DC Resistance (DCR) (Max) 30mOhm
Impedance @ Frequency 7Ohm @ 100MHz
Height 1.0922mm
RoHS Status ROHS3 Compliant
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HF30ACC201209-T Documents

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