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HFE1600D1U Tech Specifications

TDK  HFE1600D1U technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Operating Temperature --
Series Lo-PRO®file, 513
Packaging Bulk
Part Status Active
Termination Solder
Type DIP, 0.6 (15.24mm) Row Spacing
Current Rating 3A
Pitch - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
Contact Resistance --
Termination Post Length 0.125 (3.18mm)
Pitch - Post 0.100 (2.54mm)
Features Closed Frame
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish Thickness - Post 200.0µin (5.08µm)
Material Flammability Rating UL94 V-0
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