B66317-G500-X187 Tech Specifications

TDK  B66317-G500-X187 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Number of Pins -Pin
Core Material N87
Lead Free Status / RoHS Status --
CCT(K) 3000K 3-Step MacAdam Ellipse
Temperature-Test 85°C
Series Vero® SE 13 Array
Packaging Tray
Size / Dimension 36.20mm Diameter
Tolerance -
Part Status Active
Moisture Sensitivity Level (MSL) --
Type Chip On Board (COB)
Color White, Warm
Termination Style -
Configuration Round
Inductance 151 nH
Voltage - Forward (Vf) (Typ) 30.9V
Viewing Angle 120°
Core Size 25 x 13 x 7 (EF 25)
Current - Test 500mA
Lumens/Watt @ Current - Test 141 lm/W
CRI (Color Rendering Index) 80
Current - Max 1A
Lens Type Flat
Flux @ Current/Temperature - Test 2173 lm (Typ)
Light Emitting Surface (LES) 13.40mm Diameter
Wavelength --
Product Ferrite Cores
Features --
Height 3.60mm
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