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TSM3446CX6 Tech Specifications
Taiwan Semiconductor TSM3446CX6 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | Production (Last Updated: 2 years ago) | |
| Number of Pins | 6Pins | |
| Breakdown Voltage / V | 51 V | |
| Reverse Stand-off Voltage | 24 V | |
| Manufacturer Lifecycle Status | ACTIVE (Last Updated: 2 years ago) | |
| RoHS | Compliant | |
| Resistance | 27 mΩ | |
| Max Operating Temperature | 150 °C | |
| Min Operating Temperature | -55 °C | |
| Max Power Dissipation | 2 W | |
| Number of Channels | 2Channels | |
| Power Dissipation | 200 mW | |
| Max Reverse Leakage Current | 1 µA | |
| Clamping Voltage | 70.1 V | |
| Peak Pulse Current | 21.4 A | |
| Peak Pulse Power | 1.5 kW | |
| Test Current | 2.5 mA | |
| Drain to Source Voltage (Vdss) | 20 V | |
| Forward Voltage | 1 V | |
| Zener Voltage | 75 V | |
| Reverse Recovery Time | 50 ns | |
| Continuous Drain Current (ID) | 5.3 A | |
| Threshold Voltage | 700 mV | |
| Max Repetitive Reverse Voltage (Vrrm) | 250 V | |
| Gate to Source Voltage (Vgs) | 870 mV | |
| Input Capacitance | 700 pF | |
| Max Breakdown Voltage | 9.8 V | |
| Max Forward Surge Current (Ifsm) | 2.5 A | |
| Max Junction Temperature (Tj) | 150 °C | |
| Nominal Vgs | 700 mV | |
| Min Breakdown Voltage | 25.4 V | |
| REACH SVHC | No SVHC |
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