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BZW06-33BR0 Tech Specifications

Taiwan Semiconductor  BZW06-33BR0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Diode Element Material SILICON
Number of Terminals 2Terminals
Package Description O-PALF-W2
Package Style LONG FORM
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -55 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 175 °C
Rohs Code Yes
Manufacturer Part Number BZW06-33BR0
Power Dissipation (Max) 1.7 W
Package Shape ROUND
Manufacturer Taiwan Semiconductor Manufacturing Company Limited
Number of Elements 1 Element
Part Life Cycle Code Active
Ihs Manufacturer TAIWAN SEMICONDUCTOR CO LTD
Risk Rank 5.35
ECCN Code EAR99
Additional Feature EXCELLENT CLAMPING CAPABILITY
HTS Code 8541.10.00.50
Technology AVALANCHE
Terminal Position AXIAL
Terminal Form WIRE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code compliant
JESD-30 Code O-PALF-W2
Polarity BIDIRECTIONAL
Configuration SINGLE
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE
Case Connection ISOLATED
Rep Pk Reverse Voltage-Max 33.3 V
JEDEC-95 Code DO-204AC
Non-rep Peak Rev Power Dis-Max 600 W
Breakdown Voltage-Min 37.1 V
Breakdown Voltage-Max 47 V
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