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BZW04-15R0 Tech Specifications

Taiwan Semiconductor  BZW04-15R0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Surface Mount NO
Diode Element Material SILICON
Number of Terminals 2Terminals
Number of Elements per Chip 1
Dimensions 5.2 x 2.7 x 2.7mm
Package Type DO-15
Maximum Operating Temperature +175 °C
Minimum Operating Temperature -65 °C
Direction Type Uni-Directional
Package Description O-PALF-W2
Package Style LONG FORM
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -55 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 175 °C
Rohs Code Yes
Manufacturer Part Number BZW04-15R0
Power Dissipation (Max) 1 W
Package Shape ROUND
Manufacturer Taiwan Semiconductor Manufacturing Company Limited
Number of Elements 1 Element
Part Life Cycle Code Active
Ihs Manufacturer TAIWAN SEMICONDUCTOR CO LTD
Risk Rank 5.23
JESD-609 Code e3
ECCN Code EAR99
Terminal Finish MATTE TIN
Additional Feature EXCELLENT CLAMPING CAPABILITY, LOW IMPEDANCE
HTS Code 8541.10.00.50
Technology AVALANCHE
Terminal Position AXIAL
Terminal Form WIRE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code compliant
Pin Count 2
JESD-30 Code O-PALF-W2
Polarity UNIDIRECTIONAL
Configuration SINGLE
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE
Case Connection ISOLATED
Test Current 1mA
Rep Pk Reverse Voltage-Max 15.3 V
JEDEC-95 Code DO-204AL
Non-rep Peak Rev Power Dis-Max 400 W
Diode Configuration Single
Breakdown Voltage-Min 17.1 V
Breakdown Voltage-Max 18.9 V
Width 2.7mm
Height 2.7mm
Length 5.2mm
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