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STPAC02F1 Tech Specifications
STMicroelectronics STPAC02F1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Surface Mount | |
| Package / Case | 8-WFBGA, FCBGA | |
| Surface Mount | YES | |
| Number of Pins | 8Pins | |
| Packaging | Tape & Reel (TR) | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 8Terminations | |
| Type | Integrated Circuit (IC) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -30°C | |
| Voltage - Supply | 2.3V~3.3V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Supply Voltage | 2.8V | |
| Terminal Pitch | 0.5mm | |
| Frequency | 800MHz~2.5GHz | |
| Base Part Number | STPAC02 | |
| Pin Count | 8 | |
| Supply Voltage-Max (Vsup) | 3.3V | |
| Temperature Grade | OTHER | |
| Supply Voltage-Min (Vsup) | 2.3V | |
| Operating Supply Current | 1.6mA | |
| RF Type | AMPS, CDMA, DCS, GSM, TDMA | |
| Length | 1.57mm | |
| Height Seated (Max) | 0.715mm | |
| Width | 1.57mm | |
| Thickness | 660μm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Contains Lead |
STPAC02F1 Documents
Download datasheets and manufacturer documentation for STPAC02F1
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