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S29GL064M11BFIR0

Spansion  S29GL064M11BFIR0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 63Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SPANSION INC
Package Description FBGA, BGA63,8X12,32
Access Time-Max 110 ns
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA63,8X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 3.3 V
ECCN Code EAR99
Type NOR TYPE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code R-PBGA-B63
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.06 mA
Organization 8MX8
Memory Width 8
Standby Current-Max 0.000005 A
Memory Density 67108864 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 128Sectors/Sizes
Sector Size 64K
Page Size 8 words
Ready/Busy YES
Boot Block BOTTOM/TOP
Common Flash Interface YES

S29GL064M11BFIR0

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