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MB9AF114MAPMC Tech Specifications

Spansion  MB9AF114MAPMC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Contact plating gold-plated
Number of pins 16pins
Number of Terminals 80Terminals
Bundle Center to Mounting Center 262144
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer SPANSION INC
Package Description LFQFP,
Clock Frequency-Max 48 MHz
Number of I/O Lines 66I/O Lines
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Supply Voltage-Max 5.5 V
Supply Voltage-Min 2.7 V
Supply Voltage-Nom 4.5 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 2x8
Row pitch 2.54mm
Gross weight 1.46 g
Operating temperature -40...163°C
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Current rating 1.5A
JESD-30 Code S-PQFP-G80
Temperature Grade INDUSTRIAL
Speed 40 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
Seated Height-Max 1.7 mm
Address Bus Width 21
Coil Type 32768
On Chip Program ROM Width 8
External Data Bus Width 8
Rated voltage 60V
ROM Programmability FLASH
Profile beryllium copper
Length 12 mm
Width 12 mm
Plating thickness 0.75µm
Flammability rating UL94V-0
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MB9AF114MAPMC Documents

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