SMSC COM2661-3 Application Specific MCUs
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COM2661-3 Tech Specifications
SMSC COM2661-3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 28Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STANDARD MICROSYSTEMS CORP | |
| Package Description | DIP, DIP28,.6 | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| Supply Voltage-Nom | 5 V | |
| JESD-609 Code | e0 | |
| Terminal Finish | TIN LEAD | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | 235 | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-XDIP-T28 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | |
| Boundary Scan | NO | |
| External Data Bus Width | 8 | |
| Number of Serial I/Os | 1Serial I/O | |
| Communication Protocol | ASYNC, BIT; SYNC, BYTE; BISYNC |
COM2661-3 Documents
Download datasheets and manufacturer documentation for COM2661-3
- DatasheetsSMSCS01022-1.pdf
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