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M393A4K40BB1-CRC PROJECT Tech Specifications

Samsung  M393A4K40BB1-CRC PROJECT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) 4A994.a
Automotive No
PPAP No
Module DRAM Module
Module Density 32Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.175
Maximum Clock Rate (MHz) 2400
Chip Configuration 2Gx4
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 16Chip Banks
CAS Latency 17
SPD EEPROM Support No
Mounting Socket
Package Height 31.25
Package Width 3.9(Max)
Package Length 133.35
PCB changed 288
Supplier Package RDIMM
Lead Shape No Lead
Part Status Active
Pin Count 288
Organization 4Gx72
PLL No
Self Refresh Yes
Module Type 288RDIMM
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