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M378A1K43BB2-CTD00 Tech Specifications

Samsung  M378A1K43BB2-CTD00 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8542.32.00.36
Automotive No
PPAP No
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 2666
Chip Configuration 1Gx8
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Operating Current (mA) 992
ECC Support No
Number of Ranks SingleRank
CAS Latency 19
Mounting Socket
Package Height 31.25
Package Width 2.61
Package Length 133.35
PCB changed 288
Supplier Package UDIMM
Part Status LTB
Pin Count 288
Organization 1Gx64
Module Type 288UDIMM
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