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K9F5608Q0C-JCB0

Samsung  K9F5608Q0C-JCB0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 63Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA63,10X12,32
Access Time-Max 30 ns
Moisture Sensitivity Levels 1
Number of Words 33554432 wordsWord
Number of Words Code 32000000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA63,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish MATTE TIN
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B63
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Supply Current-Max 0.02 mA
Organization 32MX8
Memory Width 8
Standby Current-Max 0.00005 A
Memory Density 268435456 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 2K
Sector Size 16K
Page Size 512 words
Ready/Busy YES

K9F5608Q0C-JCB0

Download datasheets and manufacturer documentation for   K9F5608Q0C-JCB0

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