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K9F2816Q0C-HCB0 Tech Specifications

Samsung  K9F2816Q0C-HCB0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 63Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Access Time-Max 40 ns
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA63,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
ECCN Code EAR99
Type SLC NAND TYPE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B63
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Supply Current-Max 0.015 mA
Organization 8MX16
Memory Width 16
Standby Current-Max 0.00005 A
Memory Density 134217728 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 1K
Sector Size 8K
Page Size 256 words
Ready/Busy YES
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K9F2816Q0C-HCB0 Documents

Download datasheets and manufacturer documentation for   K9F2816Q0C-HCB0

  • Datasheets
K9F2816Q0C-HCB0 brand manufacturers: Samsung Semiconductor, Twicea stock, K9F2816Q0C-HCB0 reference price.Samsung Semiconductor. K9F2816Q0C-HCB0 parameters, K9F2816Q0C-HCB0 Datasheet PDF and pin diagram description download.You can use the K9F2816Q0C-HCB0 Memory - Modules, DSP Datesheet PDF, find K9F2816Q0C-HCB0 pin diagram and circuit diagram and usage method of function,K9F2816Q0C-HCB0 electronics tutorials.You can download from the Twicea.