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RFN1L6STE25 Tech Specifications

ROHM Semiconductor  RFN1L6STE25 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case DO-214AC, SMA
Number of Pins 2Pins
Diode Element Material SILICON
Number of Elements 1 Element
Packaging Tape & Reel (TR)
Published 2011
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form C BEND
Base Part Number RFN1L6S
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 1μA @ 600V
Voltage - Forward (Vf) (Max) @ If 1.45V @ 800mA
Forward Current 800mA
Max Reverse Leakage Current 1μA
Operating Temperature - Junction 150°C Max
Max Surge Current 15A
Output Current-Max 0.8A
Max Reverse Voltage (DC) 600V
Average Rectified Current 800mA
Reverse Recovery Time 35 ns
Peak Reverse Current 1μA
Max Repetitive Reverse Voltage (Vrrm) 600V
Peak Non-Repetitive Surge Current 15A
Recovery Time 25 ns
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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