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BU90T82-ZE2 Tech Specifications
ROHM Semiconductor BU90T82-ZE2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 15 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 72-TFBGA | |
| Surface Mount | YES | |
| Usage Level | Industrial grade | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Cut Tape (CT) | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 72Terminations | |
| Type | Driver | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 1.62V~3.6V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.65mm | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | S-PBGA-B72 | |
| Supply Voltage-Max (Vsup) | 1.98V | |
| Supply Voltage-Min (Vsup) | 1.62V | |
| Data Rate | 1.218Gbps | |
| Protocol | LVDS | |
| Number of Drivers/Receivers | 8/0Drivers/Receiver | |
| Length | 7mm | |
| Height Seated (Max) | 1.2mm | |
| Width | 7mm | |
| RoHS Status | ROHS3 Compliant |
BU90T82-ZE2 Documents
Download datasheets and manufacturer documentation for BU90T82-ZE2
- DatasheetsBU90T82
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