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BAW56HMT116 Tech Specifications

ROHM Semiconductor  BAW56HMT116 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Diode Element Material SILICON
Number of Elements 2 Elements
Operating Temperature (Max.) 150°C
Power Dissipation (Max) 0.25W
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Additional Feature HIGH RELIABILITY
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-G3
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 100nA @ 80V
Voltage - Forward (Vf) (Max) @ If 1.25V @ 150mA
Forward Current 125mA
Operating Temperature - Junction 150°C Max
Output Current-Max 0.215A
Voltage - DC Reverse (Vr) (Max) 80V
Current - Average Rectified (Io) 215mA DC
Reverse Recovery Time 4ns
Rep Pk Reverse Voltage-Max 100V
Diode Configuration 1 Pair Common Anode
RoHS Status RoHS Compliant
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BAW56HMT116 Documents

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