Rochester Electronics 74HCT74PW Flip Flops
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74HCT74PW
Rochester Electronics 74HCT74PW technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 14Terminals | |
| Package Description | 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14 | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Moisture Sensitivity Levels | 1 | |
| Load Capacitance (CL) | 50 pF | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | TSSOP14,.25 | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | 30 | |
| Operating Temperature-Max | 125 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | 74HCT74PW | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | NXP Semiconductors | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Max | 18000000 Hz | |
| Risk Rank | 5 | |
| Part Package Code | TSSOP | |
| JESD-609 Code | e4 | |
| Pbfree Code | Yes | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | FF/Latches | |
| Packing Method | TUBE | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 2Functions | |
| Terminal Pitch | 0.65 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 14 | |
| JESD-30 Code | R-PDSO-G14 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Power Supplies | 5 V | |
| Temperature Grade | AUTOMOTIVE | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Number of Bits | 1Bit | |
| Family | HCT | |
| Seated Height-Max | 1.1 mm | |
| Output Polarity | COMPLEMENTARY | |
| Logic IC Type | D FLIP-FLOP | |
| Max I(ol) | 0.004 A | |
| Trigger Type | POSITIVE EDGE | |
| Propagation Delay (tpd) | 53 ns | |
| fmax-Min | 18 MHz | |
| Width | 4.4 mm | |
| Length | 5 mm |
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