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M66FBTEA-03-STD Tech Specifications

Quectel  M66FBTEA-03-STD technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 52-SMD Module
RoHS Details
Interface Type GPIO, I2C, I2S, SPI, UART, USB, USIM
Supply Voltage-Min 3.3 V
Supply Current Receiving 1.3 mA
Minimum Operating Temperature - 35 C
Maximum Operating Temperature + 75 C
Factory Pack QuantityFactory Pack Quantity 1
Supply Voltage-Max 3.3 V
Package Box
Base Product Number M66
Mfr Quectel
Product Status Active
Antenna Connector Type Pad
Protocol - WiFi - 802.11 -
Dimensions 17.7 mm x 15.8 mm x 2.3 mm
Protocol - Sub GHz -
Packaging Tray
Operating Temperature -40°C ~ 85°C
Series -
Voltage - Supply 3.3V ~ 4.6V
Frequency 850MHz, 900MHz, 1.8GHz, 1.9GHz
Operating Supply Voltage 3.3 V
Memory Size -
Output Power 23 dBm
Data Rate 85.6kbps
Utilized IC / Part -
Protocol Bluetooth v3.0, GSM, GPRS
Power - Output -
RF Family/Standard Bluetooth, Cellular
Antenna Type Antenna Not Included
Sensitivity -109dBm
Serial Interfaces UART
Current - Receiving 1.3mA
Current - Transmitting -
Modulation -
Product LTE Cat NB1
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