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B39431R 970H110 Tech Specifications

Qualcomm  B39431R 970H110 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole, Right Angle
Contact Shape Square
Voltage, Rating --
Mated Stacking Heights --
Contact Materials Copper Alloy
Contact Finish Mating Tin-Lead
Insulation Materials Thermoplastic
Contact Length-Mating 0.230 (5.84mm)
Factory Pack QuantityFactory Pack Quantity 3000
Manufacturer Qualcomm RF360
Brand RF360
RoHS Details
Operating Temperature -65°C ~ 105°C
Series AMPMODU Mod II
Packaging Bulk
Part Status Discontinued at Digi-Key
Termination Solder
Connector Type Header, Breakaway
Number of Positions 44Positions
Applications --
Number of Rows 2Rows
Fastening Type Push-Pull
Subcategory Resonators
Contact Type Male Pin
Ingress Protection --
Insulation Height 0.238 (6.05mm)
Style Board to Board or Cable
Number of Positions Loaded All
Current Rating 3A
Pitch - Mating 0.100 (2.54mm)
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.120 (3.05mm)
Shrouding Unshrouded
Contact Finish - Post Tin-Lead
Overall Contact Length --
Product Type Resonators
Features --
Product Category Resonators
Contact Finish Thickness - Mating 100.0µin (2.54µm)
Contact Finish Thickness - Post 100.0µin (2.54µm)
Material Flammability Rating UL94 V-0
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