Qorvo RF5725 Telecom Interface ICs BOTTOM
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RF5725 Tech Specifications
Qorvo RF5725 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 10Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | QORVO INC | |
| Package Description | HBCC, | |
| Moisture Sensitivity Levels | 2 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HBCC | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG | |
| Supply Voltage-Nom | 3.4 V | |
| ECCN Code | 5A991.G | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BUTT | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.6 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| JESD-30 Code | S-XBCC-B10 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | OTHER | |
| Seated Height-Max | 1.05 mm | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Width | 3 mm | |
| Length | 3 mm |
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