Qorvo RF3230 Telecom Interface ICs BOTTOM
Min. : 1
Mult. : 1
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RF3230
Qorvo RF3230 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 31Terminals | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HBCC | |
| Package Equivalence Code | LCC30(UNSPEC) | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | QORVO INC | |
| Package Description | HBCC, LCC30(UNSPEC) | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG | |
| Supply Voltage-Nom | 3.6 V | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -20 °C | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BUTT | |
| Number of Functions | 1Function | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | R-XBCC-B31 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | OTHER | |
| Supply Current-Max | 2.6 mA | |
| Seated Height-Max | 1.015 mm | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Width | 6 mm | |
| Length | 7 mm |
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