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HC-D 40-ESTC-R Tech Specifications

Phoenix Contact  HC-D 40-ESTC-R technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Number of I/Os 308I/Os
Package Tray
Base Product Number XCZU19
Mfr AMD
Product Status Active
Operating Temperature -40°C ~ 100°C (TJ)
Series Zynq® UltraScale+™ MPSoC EG
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Flash Size -
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