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BF821 Tech Specifications
Philips Semiconductors BF821 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Conductor material | copper | |
| Exterior Housing Material | 1 | |
| Gross weight | 1.13 | |
| Transport packaging size/quantity | 48*32*27/12800 | |
| Purpose | connecting and branching individual insulated single-core conductors | |
| Teral type | sert IDCmin | |
| Additional | recommended tool - E9Y or equivalent | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
| Operating Temperature-Max | 150 °C | |
| Transition Frequency-Nom (fT) | 60 MHz | |
| JESD-609 Code | e3 | |
| ECCN Code | EAR99 | |
| Type | Individual connector, 3 cores | |
| Terminal Finish | MATTE TIN | |
| Color | red marking | |
| Peak Reflow Temperature (Cel) | 260 | |
| Depth | 20.5 mm | |
| Reach Compliance Code | unknown | |
| Configuration | SINGLE | |
| Polarity/Channel Type | PNP | |
| Operating temperature range | -40 …+60 °C | |
| Power Dissipation-Max (Abs) | 0.31 W | |
| Collector Current-Max (IC) | 0.05 A | |
| DC Current Gain-Min (hFE) | 50 | |
| Conductor diameter | 0.4 - 0.7 (up to 1.67 by insulation) mm | |
| Height | 6.0 (body) mm | |
| Width | 12.0 mm |
BF821 Documents
Download datasheets and manufacturer documentation for BF821
- Datasheets221b1c7438a6690a9ea31e074b80011f.pdf
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