CMDBIG-X Tech Specifications

Panduit  CMDBIG-X technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 2 Weeks
Package / Case Module
Material Acrylonitrile Butadiene Styrene (ABS)
Packaging Bulk
Series Mini-Com®
Published 2001
Size / Dimension 18.30mm Hx31.50mm W
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Type Blank Insert, Module
Color Gray
Radiation Hardening No
RoHS Status RoHS Compliant
View Similar

CMDBIG-X Documents

Download datasheets and manufacturer documentation for   CMDBIG-X

CMDBIG-X brand manufacturers: Panduit Corp, Twicea stock, CMDBIG-X reference price.Panduit Corp. CMDBIG-X parameters, CMDBIG-X Datasheet PDF and pin diagram description download.You can use the CMDBIG-X Keystone - Accessories, DSP Datesheet PDF, find CMDBIG-X pin diagram and circuit diagram and usage method of function,CMDBIG-X electronics tutorials.You can download from the Twicea.