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MMBD6100LT1G Tech Specifications

ON Semiconductor  MMBD6100LT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Factory Lead Time 5 Weeks
Contact Plating Tin
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Packaging Tape & Reel (TR)
Published 2006
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.70
Voltage - Rated DC 70V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Current Rating 200mA
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MMBD6100
Pin Count 3
Element Configuration Common Cathode
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Standard
Current - Reverse Leakage @ Vr 100nA @ 50V
Power Dissipation 300mW
Voltage - Forward (Vf) (Max) @ If 1.1V @ 100mA
Forward Current 200mA
Max Reverse Leakage Current 100nA
Operating Temperature - Junction -55°C~150°C
Max Surge Current 500mA
Output Current-Max 0.2A
Halogen Free Halogen Free
Current - Average Rectified (Io) 200mA DC
Forward Voltage 1.1V
Max Reverse Voltage (DC) 70V
Average Rectified Current 200mA
Reverse Recovery Time 4 ns
Peak Reverse Current 100nA
Max Repetitive Reverse Voltage (Vrrm) 70V
Peak Non-Repetitive Surge Current 500mA
Diode Configuration 1 Pair Common Cathode
Max Forward Surge Current (Ifsm) 500mA
Recovery Time 4 ns
Height 1.016mm
Length 3.0226mm
Width 1.397mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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MMBD6100LT1G Documents

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