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MMBD2837LT1G

ON Semiconductor  MMBD2837LT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Factory Lead Time 2 Weeks
Contact Plating Tin
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Packaging Cut Tape (CT)
Published 2004
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.70
Capacitance 4pF
Voltage - Rated DC 75V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Current Rating 150mA
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MMBD2837
Pin Count 3
Element Configuration Common Cathode
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Standard
Current - Reverse Leakage @ Vr 100nA @ 30V
Power Dissipation 225mW
Voltage - Forward (Vf) (Max) @ If 1.2V @ 100mA
Forward Current 150mA
Max Reverse Leakage Current 100nA
Operating Temperature - Junction -55°C~150°C
Output Current-Max 0.15A
Halogen Free Halogen Free
Forward Voltage 1V
Max Reverse Voltage (DC) 30V
Average Rectified Current 100mA
Reverse Recovery Time 4 ns
Peak Reverse Current 100nA
Max Repetitive Reverse Voltage (Vrrm) 30V
Diode Configuration 1 Pair Common Cathode
Recovery Time 4 ns
Height 1.01mm
Length 3.04mm
Width 1.4mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free

MMBD2837LT1G

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