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MBRF30H60CTG Tech Specifications

ON Semiconductor  MBRF30H60CTG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status LAST SHIPMENTS (Last Updated: 1 day ago)
Mounting Type Through Hole
Package / Case TO-220-3 Full Pack
Surface Mount NO
Number of Pins 3Pins
Weight 4.535924g
Diode Element Material SILICON
Number of Elements 2 Elements
Packaging Tube
Series SWITCHMODE™
Published 2001
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
Termination Through Hole
ECCN Code EAR99
Terminal Finish Tin (Sn)
Max Operating Temperature 175°C
Min Operating Temperature -55°C
Applications EFFICIENCY
Additional Feature LOW POWER LOSS
HTS Code 8541.10.00.80
Terminal Position SINGLE
Base Part Number MBRF30H60CT
Pin Count 3
Element Configuration Common Cathode
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 300μA @ 60V
Voltage - Forward (Vf) (Max) @ If 620mV @ 15A
Case Connection ISOLATED
Forward Current 15A
Max Reverse Leakage Current 300μA
Operating Temperature - Junction -55°C~175°C
Max Surge Current 260A
Output Current-Max 7.5A
Forward Voltage 780mV
Max Reverse Voltage (DC) 60V
Average Rectified Current 15A
Number of Phases 1Phase
Peak Reverse Current 300μA
Max Repetitive Reverse Voltage (Vrrm) 60V
JEDEC-95 Code TO-220AB
Peak Non-Repetitive Surge Current 260A
Diode Configuration 1 Pair Common Cathode
Max Forward Surge Current (Ifsm) 260A
Height 6.35mm
Length 8.89mm
Width 6.35mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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