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GBPC3510 Tech Specifications
ON Semiconductor GBPC3510 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 12 Weeks | |
| Mount | Screw | |
| Mounting Type | QC Terminal | |
| Package / Case | 4-Square, GBPC | |
| Number of Pins | 4Pins | |
| Supplier Device Package | GBPC | |
| Weight | 16.74g | |
| Number of Elements | 1 Element | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Bulk | |
| Published | 2011 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Quick Connect | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -55°C | |
| Capacitance | 180pF | |
| Voltage - Rated DC | 1kV | |
| Max Power Dissipation | 83.3W | |
| Current Rating | 35A | |
| Base Part Number | GBPC3510 | |
| Voltage - Rated AC | 700V | |
| Max Output Current | 35A | |
| Element Configuration | Single | |
| Diode Type | Single Phase | |
| Current - Reverse Leakage @ Vr | 5μA @ 1000V | |
| Output Current | 35A | |
| Voltage - Forward (Vf) (Max) @ If | 1.1V @ 17.5A | |
| Forward Current | 35A | |
| Max Surge Current | 400A | |
| Current - Average Rectified (Io) | 35A | |
| Forward Voltage | 1.1V | |
| Average Rectified Current | 35A | |
| Peak Reverse Current | 5μA | |
| Max Repetitive Reverse Voltage (Vrrm) | 1kV | |
| Hole Diameter | 5.6 mm | |
| Peak Non-Repetitive Surge Current | 400A | |
| Max Forward Surge Current (Ifsm) | 400A | |
| Voltage - Peak Reverse (Max) | 1kV | |
| Reverse Voltage (DC) | 700V | |
| Height | 11.23mm | |
| Length | 29mm | |
| Width | 29mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
GBPC3510 Documents
Download datasheets and manufacturer documentation for GBPC3510
- DatasheetsGBPC 12, 15, 25, 35 Series
- Environmental InformationMaterial Declaration GBPC3510
- PCN Design/SpecificationLogo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
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